Precision Polishing Pads
Marubeni offers polishing pads for a variety of industrial, high-tech applications including silicon wafers, aluminum disks, glass substrates, CMP, plastics, and many other metal surfaces.
Marubeni offers polishing pads for a variety of industrial, high-tech applications including silicon wafers, aluminum disks, glass substrates, CMP, plastics, and many other metal surfaces.
Marubeni Silicon Valley has partnered with Fujibo, a manufacturer and developer of polishing pads used in various applications ranging from semiconductor wafer polishing and computer hard disk polishing to ceramic and glass polishing. A full range of polishing pad products are available below.
Marubeni manufactures the POLYPAS FP Series, which is a family of polyurethane impregnated non-woven pads with various hardness. These pads provide better flatness for surface polishing, thus their main applications are for wafer polishing, glass polishing, hard disk, stainless steel, and copper sheet polishing.
Various types of suede polishing pads are available to satisfy your polishing requirements. Fujibo continues to develop newer and better polishing pads in response to the tighter tolerances required for polishing wafers, disks, and glasses, etc., including CMP devices in the semiconductor industry. We can control various physical properties of suede nap, such as pore size, hardness, density, and compressibility, to meet your specific requirements. These suede pads are available with a variety of pad substrates to meet your particular requirements.
POLYPAS FXA Series is a family of hard polyurethane pads for various applications such as polishing wafers, glass, quartz, and optical lens. POLYPAS FXA Series consists of constant and highly independent bubbles, and is more resistant to temperature when compared to conventional urethane pads. These pads are designed to offer excellent flatness and chemical resistance.
POLYPAS FX Series is a family of fixed abrasive polishing pads especially developed for polishing glass materials, such as glass substrates for LCD, glass disks, and optical lens. In addition to the characteristics of FXA Series, FX Series is available with a variety of physical properties, as well as types of abrasives, and surface patterns to accommodate your specific requirements.
Fujibo offers a variety of polishing pads for CMP (Chemical Mechanical Planarization) applications as well as the capability to develop new pads for your specific needs. Various grooving and embossing services are also available. The experience and know-how we have garnered in high volume production scenarios guarantees consistent and defect-free quality and performance.
Waxless mounting pads are used for mounting silicon wafers, LCD substrates, and glass panels without wax. POLYPAS Waxless mounting pads provide excellent flatness, life, and productivity by automation. Washing by solvents is not necessary, which results in shorter process time, and lower cost. Environmentally friendly.
POLYPAS Waxless mounting pads are suitable for inserts in carriers. Fujibo offers variety of pads to choose from, depending on your application and superior flatness. Inserts can be changed in a short period of time and offers better efficiency and lower cost.
Available in the following Substrate types: